The connector works in an excessively high temperature environment, which will cause deformation of the contact components and cause damage to the mechanical properties.
Bad; it also accelerates the oxidation of metal materials, generates an insulating film layer, and increases the contact resistance;
Changes in voltage drop caused by point softening or melting. Wet electrochemical environment causes hydrogen evolution on metal surfaces
Corrosion, oxygen-absorbing decay candles, concentration corrosion, galvanic cell decay candles, lit candles, microporous decay candles and electron migration, etc.
Causes the connector to malfunction. Aware of dust-to-connector performance in the mid-1950s
And the research on its effect mechanism has been carried out.
The surface of the silver contacts in the clean and dirty pool was studied at different degrees, and the resistance temperature coefficients of different surfaces were obtained.
The sulfide film on the silver surface was investigated, and it was pointed out that the conduction properties of the electron tunneling effect under low temperature conditions,
The properties of the lower film are shown as type semiconductors. Environmental pollution in Europe has improved in the 1980s.
But even so, the doctor discovered through research that the communication equipment is still affected by the pollution of dust particles.
Ring down. Our country has more developed environmental pollution due to economic development and industrial construction.
Master Degree Thesis of Engineering, Beijing Youtun University
There is a gap between countries, and the degree of dust pollution is more extensive. Therefore, Professor Zhang Jigao and Zhou Yilin of Beijing University of Posts and Telecommunications
Professors, Professor Gao Jinchun and other scholars analyzed the composition of dust particles in China and discussed the positive and negative charged particles in dust
The mechanism of the effect of the electron on electric shock, the role of the water-soluble particles in the rot candle and the gold-plated connection
The shape of microporous decay candle on the surface of the device was analyzed, and the measurement method of microporosity was proposed.