Chip junction temperature = ambient temperature + thermal resistance * power consumption
Therefore, the entire heat dissipation process is mostly subject to the influence of ambient temperature, and the influence of heat convection needs to be fully considered. Basic principle of heat dissipation design: natural heat dissipation is mainly radiation, and air cooling is mainly convection. There are three main ways of heat transfer: conduction, convection, and radiation. Among them, heat conduction mainly refers to the transfer between molecules, mainly refers to the heat diffusion inside the box or module. The main transmission link involved is device—>PCB—>outer shell. Natural convection mainly refers to the heat transfer by fluid mixing, including the heat transfer between the box or module and the external environment. Thermal radiation is mainly the transfer of energy by electromagnetic waves generated by the temperature of objects. Involves heat transfer between a box or module and the external environment. The transmission links of the above natural convection and heat radiation are both outer shell -> environment.
For the vehicle domain controller, because it carries a large number of associated ECU terminals, it may cause large heat energy in the calculation process. In the hardware design, the thermal design process will be particularly important. The vehicle domain controller can be arranged in a well-ventilated environment with good air convection. Here, it is necessary to fully consider whether there is hot air recharge at the outlet of the air duct design.