Wiring Constraints: The general rule is that the top layer of the PCB takes the RF signal, and the plane layer below the RF signal must be a complete ground plane to form a microstrip line structure. To ensure the structural integrity of the microstrip line, it must be done: the microstrip line in the same layer should be covered with copper skin. It is recommended that the edge of the ground copper skin be 3H wide from the edge of the microstrip line. H represents the thickness of the dielectric layer. Within the 3H range, no other signal vias are allowed. Do not allow RF signal traces to cross ground plane gaps on the second layer. Ground copper should be added between the uncoupled microstrip lines, and ground vias should be added to the ground copper.