Packing transistors closely together is known to cause problems with devices overheating.
But now, scientists have developed a man-made material that is the best ever to conduct heat in one direction while keeping it insulated from its surroundings in other directions. The research may one day help microchips become more powerful without being interrupted by overheating.
As electronic products continue to be miniaturized, more heat is generated in a given space, making thermal control a key challenge in electronic design. “If your computer or laptop is overheating, that could be a safety issue,” said the study’s lead author Shi En Kim, a molecular engineer at the University of Chicago.