Whether the best measures are taken for the key signal lines, such as the shortest length, protection lines, input lines and output lines are clearly separated.
Whether the analog circuit and digital circuit part have their own independent ground wires.
Whether the graphics (such as icons, labels) added to the PCB will cause short circuit of the signal.
Modify some unsatisfactory line shapes.
Are there process lines on the PCB? Whether the solder mask meets the requirements of the production process, whether the solder mask size is appropriate, and whether the character logo is pressed on the device pad, so as not to affect the electrical quality.
Whether the edge of the outer frame of the power ground layer in the multi-layer board is reduced, such as the copper foil of the power ground layer exposed outside the board, it is easy to cause a short circuit.